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Journal paper
Entry Year94
Journal level其他
Paper title (chapter)Polysiloxane-TPU改質半導體封裝用環氧樹脂之微結構及其熱性質研究
Name of journal工程科技與教育學刊
Date of publication2005-00-00
Issue No.2(2)
Starting page219
Starting page238
Authors鄭錫勳、何宗漢、呂祖尚、林烈利
Number of authors4
Author's typeFirst Author
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