:::
Journal paper
Entry Year97
Journal level其他
Paper title (chapter)半導體封裝用低應力環氧樹脂硬化物之製備及其物性研究
Name of journal工程科技與教育學刊
number of chapters5
Issue No.4
Starting page521
Starting page529
Name of author (Chinese)Ho, Tsung-Han
Name of author (English)Ho, Tsung-Han
Authors何宗漢、顏福杉、鄭錫勳、王德修
Author's typeFirst Author
Attached File File download Word
Reference URLhttp://www.engh.kuas.edu.tw/files/ne/ux6mi1y9c3.pdf
cron web_use_log