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Journal paper
Entry Year94
Journal level其他
Paper title (chapter)Polysiloxane-TPU改質半導體封裝用環氧樹脂之微結構及其熱性質研究
Name of journal工程科技與教育學刊
number of chapters2
Issue No.2
Starting page219
Starting page238
Name of author (Chinese)Ho, Tsung-Han
Name of author (English)Ho, Tsung-Han
Authors鄭錫勳、何宗漢、呂祖尚、林烈利
Attached File File download Word
Reference URLhttp://www.airiti.com/CEPS/ec_en/ecjnlarticleView.aspx?jnlcattype=1&jnlptype=2&jnltype=8&jnliid=3815&issueiid=62301&atliid=1061124
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