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Journal paper
Entry Year88
Journal level其他
Paper title (chapter)低應力半導體封裝材料之簡介
Name of journal工程月刊
number of chapters72
Issue No.11
Starting page19
Starting page28
Name of author (Chinese)Ho, Tsung-Han
Name of author (English)Ho, Tsung-Han
Authors王春山,何宗漢
Attached File File download Word
Reference URLhttp://ndltd.ncl.edu.tw/cgi-bin/gs32/gsweb.cgi?o=dnclcdr&s=id=%22082NCKU0063006%22.&searchmode=basic
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